Zhonghai has been pursuing the improvement of product performance, the breakthrough of complex processes and the reduction of delivery time Short, for the high school printed circuit board design, research and development to provide fast service platform.

Technical ability of printing board
Item		Argument	Instructions
Maximum layer number(mm)		The 16th Floor
Minimum line width(mm)		3.0mil
Minimum line spacing(mm)		3.0mil
Minimum weld ring(mm)		Through-hole：0.08	The outermost distance from the hole edge to the welded ring
		Device hole：0.18
Minimum aperture	Plate thickness<2.0mm	0.15MM	Finger hole
	Plate thickness>2.0mm	孔径比<12
Single and double panel		3.2mm
Maximum board thickness   Multi-layer board		6.0mm
Maximum size	FR4 board	1500mm*600mm
	Plate metal	1500mm*600mm
Plate type		FR4(Shengyi/Kingboard/Lianmao/Guoji); CEM1; Aluminum base; Copper based; Teflon, etc	Double-sided aluminum base; Double-sided thermoelectric separation of copper base
Special technology		Impedance, resin jack, edge metallization, half hole, thick copper, countersunk head, Goldfinger, blind hole, depth control, etc
Surface treatment		OSP, spray tin, electroplating nickel/gold, chemical nickel/gold, sinking tin, sinking silver, Electrothick gold